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文章詳情
PET瓶胚專用干燥機(jī)核心結(jié)構(gòu)
日期：2026-01-31 21:56
瀏覽次數(shù)：6
摘要：PET瓶胚專用干燥機(jī)核心結(jié)構(gòu)，PET瓶胚干燥機(jī)，結(jié)晶干燥機(jī)
PET瓶胚專用干燥機(jī)核心結(jié)構(gòu)，PET瓶胚干燥機(jī)，結(jié)晶干燥機(jī)
三、設(shè)備核心結(jié)構(gòu)與專用設(shè)計
PET 瓶胚專用干燥機(jī)圍繞 **“低露點、防吸濕、精準(zhǔn)控溫、注塑聯(lián)動”四大核心要求設(shè)計，三機(jī)一體集成式為行業(yè)主流，整體由預(yù)結(jié)晶模塊、除濕干燥模塊、密閉輸送模塊、熱風(fēng)再生模塊、智能控制模塊 ** 五大核心模塊組成。
Designed around the four core requirements of "low dew point, moisture proof, precise temperature control and injection interconnection", the PET preform special dryer takes the three-in-one integrated type as the industry mainstream, and is composed of five core modules: pre-crystallization module, dehumidification drying module, airtight conveying module, hot air regeneration module and intelligent control module.
各模塊均做瓶胚注塑專屬優(yōu)化設(shè)計，相比常規(guī)干燥機(jī)，強(qiáng)化了密閉性、保溫性和參數(shù)精準(zhǔn)性，全程實現(xiàn) PET 切片無二次吸濕、無降解、干燥均勻，為瓶胚注塑提供合格原料：
Each module is optimized and designed exclusively for preform injection moulding. Compared with conventional dryers, it strengthens airtightness, thermal insulation and parameter precision, and realizes no secondary moisture absorption, no degradation and uniform drying of PET chips throughout the process to provide qualified raw materials for preform injection moulding.
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預(yù)結(jié)晶模塊：含低速攪拌 / 振動結(jié)晶器、高精度布風(fēng)板、熱風(fēng)加熱器，核心功能是將無定形切片結(jié)晶度提升至 25%~35%，定型防粘連，同時預(yù)熱至 140~160℃，降低后續(xù)干燥熱負(fù)荷。
Pre-crystallization module: includes low-speed stirring/vibration crystallizer, high-precision air distribution plate and hot air heater. Its core function is to increase the crystallinity of amorphous chips to 25%~35%, shape and prevent adhesion, and preheat to 140~160℃ at the same time to reduce the subsequent drying heat load.
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除濕干燥模塊：核心為雙塔 / 轉(zhuǎn)輪分子篩除濕機(jī)、高溫不銹鋼加熱器、保溫干燥料斗，可將環(huán)境空氣露點降至 - 40℃~-70℃，加熱至 160~180℃形成高溫低露點熱風(fēng)，實現(xiàn)切片深度脫水。
Dehumidification and drying module: the core is a double-tower/rotary molecular sieve dehumidifier, high-temperature stainless steel heater and thermal insulation drying hopper, which can reduce the dew point of ambient air to -40℃~-70℃ and heat it to 160~180℃ to form high-temperature and low-dew-point hot air for deep dehydration of chips.
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密閉輸送模塊：含真空上料機(jī)、鎖氣旋轉(zhuǎn)閥、保溫螺旋輸送機(jī)、恒溫料斗，全程密閉輸送，杜絕切片與環(huán)境濕空氣接觸，輸送管道包裹聚氨酯保溫層，防止切片溫度驟降吸濕。
Airtight conveying module: includes vacuum feeder, air lock rotary valve, thermal insulation screw conveyor and constant temperature hopper, realizing full-process airtight conveying to prevent chips from contacting with ambient humid air. The conveying pipeline is wrapped with a polyurethane insulation layer to prevent chips from absorbing moisture due to sudden temperature drop.
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熱風(fēng)再生模塊：含循環(huán)風(fēng)機(jī)、再生加熱器、余熱回收換熱器，實現(xiàn)分子篩吸附 - 再生循環(huán)，雙塔分子篩一用一備、轉(zhuǎn)輪分子篩連續(xù)旋轉(zhuǎn)，保證低露點熱風(fēng)持續(xù)供應(yīng)，余熱回收設(shè)計降低能耗 30% 以上。
Hot air regeneration module: includes circulation fan, regeneration heater and waste heat recovery heat exchanger, realizing molecular sieve adsorption-regeneration cycle. The double-tower molecular sieve is for one use and one standby, and the rotary molecular sieve rotates continuously to ensure the continuous supply of low dew point hot air. The waste heat recovery design reduces energy consumption by more than 30%.
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智能控制模塊：含工業(yè)級 PLC、7/10 寸觸摸屏、高精度傳感器（露點 / 溫度 / 料位）、變頻調(diào)速器，支持工藝參數(shù)配方化管理，可一鍵切換不同腔數(shù)模具參數(shù)，與注塑機(jī)聯(lián)動實現(xiàn)自動供料，自帶故障診斷與報警功能。
Intelligent control module: includes industrial PLC, 7/10 inch touch screen, high-precision sensors (dew point/temperature/level) and frequency converter, supporting formula management of process parameters, one-key switching of mould parameters with different cavity numbers, automatic feeding through interconnection with injection moulding machines, and with its own fault diagnosis and alarm functions.
